Sample Circuit Building Procedure

TM 11-5895-1012-10

4-58. Procedures for Changing and

H17K, row 1, pins 3 and 4 to the DF unit transmit out-

Building Circuits

put (line side) terminated at bay 4.1 on block TB3, row

, actions necessary to change a circuit

1 pins C and D by cross-connecting block H17K, row 1,

pins 3 and 4 to block V9F, row 1, pins 3 and 4

are:

respectively and at bay 4.1, TB3, row 1 pins C and D to

(1) Patch around the in-house portion of the exist-

ing circuit, or terminate the circuit legs on the line side

TB9, row 1, pins C and D respectively.

(3) Connect the SF unit receive output (Drop) side

of the patch panels with 600-ohm terminating plugs.

(2) Remove from the universal conditioning

terminated at bay 4.1 on TB3, row 1, pins H and J to

equipment shelf the modules of the string to be

the amplifier (Al) input terminated at bay 4.1 on TB3,

row 2, pins A and B by cross-connecting TB3, row 1,

(3) Remove cross-connects and rewire the IDF in

pins H and J to TB3, row 2, pins A and B respectively.

(4) Connect the SF unit transmit input (Drop) side

the conditioning equipment bay to form the desired

terminated on TB3, row 1, pins A and B to the Pad

string.

(4) Change cross-connections on the voice fre-

(P2) output terminated on TB3, row 3, pins H and 9 by

cross-connecting TB3, row 1 pins A and B to TB3, row

quency, combined distribution frame (CDF) to obtain

the desired jack appearances and multiples, cable, or

3, pins H and J respectively.

(5) Connect the SF unit E&M leads terminated at

VFCT assignments necessary.

(5) Replace the conditioning modules.

bay 4.1 on TB3, row 1, pins K and L to the ringdown

(6) Perform the necessary in-house quality control

converter (RDC) E&M leads terminated at bay 4.1,

checks (refer to chapter 6).

TB3, row 1, pins K and L to TB3, row 6, pins K and L

(7) Remove patches or plugs installed in (1) above.

respectively.

(8) Perform the necessary station-to-station tests

(6) Connect the amplifier (Al) output terminated

(refer to chapter 6).

at hay 4.1 on TB3, row 2, pins C and D to the pad (P1)

b. Generally, actions necessary to build a new cir-

input terminated at bay 4.1 on TB3, row 3, pins A and

cuit are:

B by cross-connecting at bay 4.1, TB3, row 2, pins C

(1) Form the desired conditioning equipment

and D to TB3, row 3, pins A and B respectively.

string by cross-connecting at the IDF above the bay.

(7) Connect the pad (P2) input terminated at hay

(2) Cross-connect at the VF CDF to connect the

4.1 on TB3, row 3, pins E and F to the amplifier (A2)

string to the desired patch panels (insert dummy plugs

output terminated at bay 4.1 on TB3, row 2, pins H

in all line jacks if the patch panels are already wired to

and J by cross-connecting at bay 4.1, TB3, row 3, pins

a multiplex or channel VFCT, or cable pair).

E and F to TB3, row 2, pins H and J respectively.

(3) Plug in all conditioning equipment modules.

(8) Connect the pad (P1) output terminated at hay

(4) Perform the necessary in-house quality control

4.1 on TB3, row 3, pins C and D to the echo suppressor

checks (refer to chapter 6).

receive input (line) terminated at bay 4.1 on TB3, row

(5) Cross-connect the patch panels to the appro-

4, pins E and F by cross-connecting at bay 4.1, TB3

priate multiplex or VFCT channel or cable pair at the

row 3, pins C and D to TB3, row 4, pins E and F respec-

VF CDF (or remove dummy plugs if previously wired).-

tively .

(6) Perform the necessary out-of-service station-

(9) Connect the amplifier (A2) input terminated at

to-station quality control tests (refer to chapter 6).

bay 4.1 on TB3, row 2, pins E and F to the echo sup-

pressor transmit output terminated at bay 4.1, TB3,

4-59. Sample Circuit Building Procedure

row 4, pins C and D by cross-connecting at bay 4.1 on

The sample process for building voice frequency cir-

TB3, row 2, pins E and F to row 4, pins C and D respec-

cuit configuration figure 4-14 is as follows:

tively .

a Voice Frequency Circuit Connections. Refer to

(10) Connect the echo suppressor receive output

the cut-sheet table 4-7 and figure 4-14 which illus-

terminated at bay 4.1 on TB3, row 4, pins H and J to

trate the following cross connection procedure.

the 2/4 wire terminating set receive input terminated

(1) Connect the Equ Out (Drop) side of the receive

at bay 4.1 on TB3, row 5, pins A and B by cross-con-

equal level patch panel circuit terminated on block

necting at bay 4.1, TB3, row 4, pins H and J to row 5,

H17J, row 1, pins 3 and 4 to the signaling frequency

pins A and B respectively.

(SF) unit receive input (line aide) terminated at bay 4.1

(11) Connect the echo suppressor transmit input

on block TB3, row 1 pins E and F by cross-connecting

terminated at bay 4.1 on TB3, row 4, pins A and B to

black H17J, row 1, pins 3 and 4 to block V9F, row 2,

the 2/4 wire terminating set transmit output mi-

pins 1 and 2 respectively and at bay 4.1, TB3, row 1,

nated at bay 4.1, on TB3, row 5, pins C and D by cross-

pins E and F to TB9, row 1, pins E and F respectively.

connecting at bay 4.1 on TB3, row 4, pins A and B to

(2) Connect the Equ In (Drop) side of the transmit

row 5, pins C and D respectively.

equal level patch panel circuit terminated on block

(12) Connect the 2/4 -wire terminating set's 2 wire

4-47